美国为TSMC拨款66亿美元,用于建造三个亚利桑那州半导体工厂,促进国内芯片生产。 The U.S. allocates $6.6 billion for TSMC to build three Arizona semiconductor plants, boosting domestic chip production.

美国商务部最后确定了对台湾半导体制造公司66亿美元的补贴,用于在亚利桑那州建造三座半导体工厂。 The U.S. Commerce Department finalized a $6.6 billion subsidy for Taiwan Semiconductor Manufacturing Company (TSMC) to build three semiconductor plants in Arizona. 这是根据旨在增加国内芯片生产的527亿美元《CHIPS法》首次主要付款。 This marks the first major disbursement under the $52.7 billion CHIPS Act, aimed at boosting domestic chip production. TSMC计划投资650亿美元,到2028年可开始生产先进的2米计芯片。 TSMC plans a $65 billion investment and could start producing advanced 2-nanometer chips by 2028. 该倡议旨在减少对外国供应商的依赖,创造大约6 000个直接就业岗位。 The initiative aims to reduce reliance on foreign suppliers and create about 6,000 direct jobs.