2025年亚利桑那州将启动4nm芯片生产, 尽管成本比台湾高30%。 TSMC to start 4nm chip production in Arizona in 2025, despite 30% higher costs than in Taiwan.

台湾半导体制造公司(TSMC)将于2025年在其亚利桑那州设施开始生产4nm芯片,预计每月为苹果公司和Nvidia公司等主要技术客户生产20 000个卷饼。 Taiwan Semiconductor Manufacturing Company (TSMC) will begin 4nm chip production at its Arizona facility in 2025, expected to produce 20,000 wafers monthly for major tech clients like Apple and Nvidia. 尽管亚利桑那州的生产成本较高,预计比台湾高30%,但TSMC计划到2028年将产量扩大到2nm芯片。 Despite higher production costs in Arizona, projected to be 30% more than in Taiwan, TSMC plans to expand to 2nm chip production by 2028. 较高的成本来自美国的有限的半导体供应链和材料。 The higher costs stem from limited semiconductor supply chains and materials in the US.