亚利桑那州立大学和 Deca Technologies 建立了北美首个 FOWLP 先进晶圆级封装应用研发中心。 Arizona State University and Deca Technologies establish North America's first FOWLP research and development center for advanced wafer-level packaging applications.
亚利桑那州立大学 (ASU) 和 Deca Technologies 合作创建北美首个扇出晶圆级封装 (FOWLP) 研发中心，旨在促进美国在半导体制造以及人工智能、机器学习、汽车电子、和高性能计算。 Arizona State University (ASU) and Deca Technologies partner to create North America's first Fan-Out Wafer-Level Packaging (FOWLP) research and development center, aimed at boosting US innovation in semiconductor manufacturing and advanced fields like AI, machine learning, automotive electronics, and high-performance computing. 先进晶圆级封装应用和开发中心将结合先进的技术、设备、工艺、材料、专业知识和培训。 The Center for Advanced Wafer-Level Packaging Applications and Development will combine advanced tech, equipment, processes, materials, expertise, and training.