应用材料扩大了芯片包装技术,以便在AI时代打击能源使用。 Applied Materials expands chip packaging tech to combat energy use in the AI age.

应用材料正在扩大其EPIC创新平台,以加速先进的芯片包装技术,这对于AI时代节能计算至关重要。 Applied Materials is expanding its EPIC innovation platform to accelerate advanced chip packaging technologies, crucial for energy-efficient computing in the AI era. 该公司在新加坡召集了行业领导人,以促进制造商、供应商和研究机构之间的合作。 The company convened industry leaders in Singapore to promote collaboration among manufacturers, suppliers, and research institutions. 这一举措旨在解决因连接设备和AI而导致的能源消耗增加的问题,促进芯片性能和可持续性的进步。 This move aims to address rising energy consumption due to connected devices and AI, fostering advancements in chip performance and sustainability.