Toray为先进的半导体推出了新的涂层技术,旨在提高效率和减少废物。 Toray unveils new coating tech for advanced semiconductors, aiming to boost efficiency and cut waste.

Toray Engineering开发了TRENG-PLP Coater,这是在AI服务器和数据中心使用的先进半导体包装装置。 Toray Engineering has developed the TRENG-PLP Coater, a device for advanced semiconductor packaging used in AI servers and data centers. 这一技术允许在较大的玻璃基质上进行2.5D包装,从而增强高性能半导体的生产。 This technology allows for 2.5D packaging on larger glass substrates, enhancing the production of high-performance semiconductors. 到2025年,托雷的目标是30亿日元,到2030年达到60亿日元,解决传统半导体包装中的废物和效率问题。 Toray targets 3 billion yen in orders by 2025 and 6 billion yen by 2030, addressing issues of waste and efficiency in traditional semiconductor packaging.