美国亚利桑那州的TSMC和Amkor技术签署了先进的包装和测试服务的谅解备忘录. TSMC and Amkor Technology sign MoU for advanced packaging and testing services in Arizona.

TSC和Amkor Technology已经签署了一项谅解备忘录,通过在Amkor即将在Peoria设立的设施建立先进的包装和测试服务,提高亚利桑那州半导体能力。 TSMC and Amkor Technology have signed a memorandum of understanding to enhance semiconductor capabilities in Arizona by establishing advanced packaging and testing services at Amkor's upcoming facility in Peoria. 这一伙伴关系旨在支持TSMC的业务,特别是针对凤凰城的客户,并配合加强美国半导体工业的努力。 This partnership aims to support TSMC's operations, particularly for customers in Phoenix, and aligns with efforts to strengthen the US semiconductor industry. 根据美国的"芯片法案",TSMC也获得了大量资金来支持这一扩张. TSMC is also receiving significant funding under the US CHIPS Act to support this expansion.

October 03, 2024

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