台积电考虑利用其 CoWoS 技术在日本建立先进封装产能，以支持日本半导体行业的复兴。 TSMC considers building advanced packaging capacity in Japan to support Japan's semiconductor industry revival, leveraging its CoWoS technology.
台积电（TSMC）正在考虑在日本建设先进封装产能，支持日本半导体行业的复兴。 Taiwan Semiconductor Manufacturing Co. (TSMC) is considering building advanced packaging capacity in Japan, supporting Japan's revival in the semiconductor industry. 台积电正在考虑将其可增强处理能力的芯片在晶圆上的基板 (CoWoS) 封装技术引入日本。 TSMC is considering bringing its chip on wafer on substrate (CoWoS) packaging technology, which enhances processing power, to Japan. 日本拥有领先的半导体材料和设备制造商、不断增长的芯片制造能力以及强大的客户群。 Japan has leading semiconductor materials and equipment makers, growing chip fabrication capacity, and a strong customer base. 由于人工智能的蓬勃发展，全球对先进半导体封装的需求不断增加，促使台积电等领先芯片制造商扩大产能。 Demand for advanced semiconductor packaging has increased globally due to the AI boom, prompting leading chipmakers like TSMC to expand their capacities.