EEJA在NEPCON JAPAN 2025展示了新的生态友好和有效的电镀技术。 EEJA unveils new eco-friendly and efficient plating technologies at NEPCON JAPAN 2025.

TANAKA集团的子公司EEJA将在2025年1月22日至24日举办的第39届NEPCON JAPAN展览中展示新的电镀技术。 EEJA, a subsidiary of TANAKA Group, will showcase new plating technologies at the 39th NEPCON JAPAN exhibition from January 22-24, 2025. 该公司将介绍诸如PRECIOUSFAB Pd/Pt/Ru/Rh/Ir在汽车电子产品中耐穿电镀的创新做法,以及PRECIOUSFAB HG/GT/GS在减少贵金属使用方面的创新做法。 The company will present innovations like PRECIOUSFAB Pd/Pt/Ru/Rh/Ir for wear-resistant plating in automotive electronics and PRECIOUSFAB HG/GT/GS for reducing precious metal use. 还特别介绍了诸如MICROFAB系列和SEADCAT等环境友好型半导体包装选项。 Environmentally friendly options like the MICROFAB series and SEADCAT for semiconductor packaging are also featured.