SK Hynix获得美国赠款和贷款,总额高达958M美元,用于在印第安纳州建造一座新的芯片厂。 SK Hynix receives U.S. grants and loans totaling up to $958M to build a new chip plant in Indiana.

美国商务部根据《CHIPS法》,向韩国芯片制造商SK Hynix颁发了4.58亿美元的赠款和高达5亿美元的贷款,用于在印第安纳州建造一个新的记忆包装厂和研究设施。 The US Commerce Department has awarded SK Hynix, a South Korean chipmaker, a $458 million grant and up to $500 million in loans to build a new memory packaging plant and research facility in Indiana, under the CHIPS Act. 这个38.7亿美元的项目旨在加强美国的半导体供应链,创造大约1 000个工作岗位。 This $3.87 billion project aims to enhance the U.S. semiconductor supply chain and create around 1,000 jobs. 该设施将产生对AI产品至关重要的高带宽记忆芯片,SK Hynix将与Purdue大学和当地企业合作。 The facility will produce high-bandwidth memory chips crucial for AI products, with SK Hynix partnering with Purdue University and local businesses. 此举是美国为刺激国内芯片生产和减少对外国供应商的依赖而作出的更广泛努力的一部分。 This move is part of broader U.S. efforts to boost domestic chip production and reduce reliance on foreign suppliers.