SEMI计划从2025-2027年开始投资400bn半导体设备, 由中国、韩国和台湾牵头。 SEMI projects $400bn semiconductor equipment investment from 2025-2027, led by China, South Korea, and Taiwan.
SEMI预测,2025年至2027年,半导体制造设备投资达到创纪录的4 000亿美元,其驱动因素是美国-中国贸易紧张时期对AI芯片和区域制造业的需求不断增加。 SEMI projects a record $400 billion investment in semiconductor manufacturing equipment from 2025 to 2027, driven by rising demand for AI chips and regional manufacturing amid U.S.-China trade tensions. 中国的支出将超过1 000亿美元,其次是韩国(810亿美元)和台湾(750亿美元)。 China will lead with over $100 billion in spending, followed by South Korea ($81 billion) and Taiwan ($75 billion). 预计美洲、日本和欧洲将分别投资630亿美元、320亿美元和270亿美元。 The Americas, Japan, and Europe are expected to invest $63 billion, $32 billion, and $27 billion, respectively. 设备支出将大幅增长,到2025年将达到1 230亿美元。 Equipment spending will grow significantly, reaching $123 billion in 2025.