Alpha波半导体为高需求部门引进了具有TSMC CoWos包装的3nm UCIe Die-Die-Die IP子系统。 Alphawave Semiconductor introduces 3nm UCIe Die-to-Die IP subsystem for high-demand sectors with TSMC's CoWoS packaging.
Alphawave Semiconductor 推出了首款 3nm 通用小芯片互连高速 （UCIe） Die-to-Die IP 子系统，采用台积电先进的 CoWoS 封装开发。 Alphawave Semiconductor has introduced the first 3nm Universal Chiplet Interconnect Express (UCIe) Die-to-Die IP subsystem, developed with TSMC's advanced CoWoS packaging. 这一次系统以高需求部门为目标,如超大型数据中心和AI, 提供8Tbps/mm的带宽密度和24Gbps的速度。 This subsystem targets high-demand sectors like hyperscale data centers and AI, offering a bandwidth density of 8 Tbps/mm and speeds of 24 Gbps. 它支持多项协议,包括健康监测特征,加强次基因计算应用的系统稳健性。 It supports multiple protocols and includes features for health monitoring, enhancing system robustness for next-gen computing applications.