西弗斯半导体公司与爱立信公司和Raytheon公司合作,从NEMC公司收到6M元,用于5G/6G IC开发。 Sivers Semiconductors receives $6M from NEMC for 5G/6G IC development in collaboration with Ericsson and Raytheon.

根据美国"芯片法案",西弗斯半导体公司获得东北微电子联盟的600万美元资助,用于开发5G和6G网络的光束变量器IC和阵列设计. Sivers Semiconductors has been awarded $6 million from the Northeast Microelectronics Coalition under the U.S. CHIPS Act to develop beamformer ICs and array designs for 5G and 6G networks. 该项目与Ericsson和Raytheon等伙伴合作,旨在加强国内原型设计,并加强美国在微电子学方面的领导作用。 This project, in collaboration with partners like Ericsson and Raytheon, aims to enhance domestic prototyping and strengthen U.S. leadership in microelectronics. 这笔资金用于支持移动通信、因特网和自主车辆应用的技术发展。 The funding supports technology development for applications in mobile communication, IoT, and autonomous vehicles.