xMEMS实验室推出XMC-2400μCooling芯片,这是一种基于振动的便携式电子产品散热技术,预计将在2025年第一季度采样. xMEMS Labs introduces XMC-2400 µCooling chip, a vibration-based heat dissipation technology for portable electronics, set to sample in Q1 2025.
xMEMS实验室推出了XMC-2400微冷却芯片,这是一种用于智能手机,平板电脑和其他便携式电子产品的芯片上风扇技术. xMEMS Labs introduces the XMC-2400 µCooling chip, a fan-on-a-chip technology for smartphones, tablets and other portable electronics. 芯片使用硅固态设计来振动小包件内的空气流,除传统的旋转扇之外,还消散热量。 The chip uses a silicon, solid-state design to vibrate airflow within its small package, dissipating heat instead of traditional spinning fans. XMC-2400比Forore Systems' AirJet技术小四倍,每卷空气流量比Frore Systems' AirJet技术多16倍。 The XMC-2400 is four times smaller and provides 16 times more airflow per volume than Frore Systems' AirJet technology. 芯片的设计甚至可以冷却最小的手持设备,使薄度更薄,高性能的AI-准备式移动设备。 The chip is designed to cool even the smallest handheld devices, enabling thinner, high-performance AI-ready mobile devices. XMEMS实验室计划在2025年第一季度将芯片样本提供给有兴趣的客户。 xMEMS Labs plans to sample the chip to interested customers in the first quarter of 2025.