美国电信公司将在2029年开设亚利桑那州的芯片包装设施,以促进国内AI生产. TSMC opens Arizona chip packaging facility in 2029 to boost domestic AI production.

台积电计划在2029年之前在亚利桑那州开设芯片包装设施,专注于人工智能芯片的先进包装技术. TSMC plans to open a chip packaging facility in Arizona by 2029, focusing on advanced packaging technologies for AI chips. 根据政府的激励措施,该举措旨在减少供应链瓶并加强国内半导体生产. The move aims to reduce supply chain bottlenecks and strengthen domestic semiconductor production following government incentives.