日本投资40亿美元, 建设半导体工厂. 2027年生产的目标是: Japan invests $4B in Rapidus for semiconductor facility aiming for 2027 production.

日本政府宣布在Rapidus投资额外40亿美元, 总融资达到163亿美元. The Japanese government announced an additional $4 billion investment in Rapidus, bringing total funding to $16.3 billion to build a semiconductor facility in Hokkaido. 该公司在 Chitose 开设了一个新的分析中心,并推出了包装解决方案,目标是到 2027 年大规模生产. The company opened a new analysis center and launched packaging solutions in Chitose, aiming for mass production by 2027. 与此同时,TSMC报告说,2026年第一季度的收入增长了35%,这是由于对先进AI芯片的高需求所推动. Meanwhile, TSMC reported a 35% revenue increase for the first quarter of 2026, driven by high demand for advanced AI chips.