印度启动半导体使命2.0以促进国内芯片生产和人工智能基础设施. India launches semiconductor mission 2.0 to boost domestic chip production and AI infrastructure.

印度正在为"半导体计划2"做准备, 在2026年预算案中包括了该项目.电子和信息技术部证实, 已进入筹备阶段. India is preparing for India Semiconductor Mission 2.0, following its inclusion in the 2026 Union Budget, with the Ministry of Electronics and Information Technology confirming the preparatory phase is active. 虽然没有公布具体的资金或时间表,但该计划是建立在第一阶段基础上,支持了10个涉及,碳化和酸盐的大型半导体项目. While no specific funding or timeline has been released, the initiative builds on the first phase, which supported ten major semiconductor projects involving silicon, silicon carbide, and gallium nitride. 目的是减少对进口芯片的依赖,加强国内人工智能服务器制造业, 这被视为数字经济的关键基础设施. The mission aims to reduce reliance on imported chips and strengthen domestic AI server manufacturing, seen as critical infrastructure for the digital economy. 现有政策如PLI计划和4万亿元的组件制造基金被认为是基础,尽管专门的人工智能硬件可能需要进一步审查. Existing policies like the PLI scheme and a ₹40,000 crore component manufacturing fund are considered foundational, though specialized AI hardware may require further policy review. 政府仍致力于随着该部门的发展而提供支持. The government remains committed to evolving support as the sector advances.