微软收购了Powerchip的台湾工厂,建造一个新的DRAM和HBM工厂,从2026年开始建设,并将在2028年开始发货. Micron acquires Powerchip’s Taiwan site to build a new DRAM and HBM plant, starting construction in 2026, with shipments by 2028.

美光科技已完成对Powerchip Semiconductor台湾通螺P5厂址的收购，并启动在该厂建设第二座半导体工厂的计划。 Micron Technology has completed its acquisition of Powerchip Semiconductor's Tongluo P5 site in Taiwan, launching plans to build a second semiconductor facility at the site. 新工厂的规模与Micron现有的Miaoli fab相似,将产生先进的DRAM和高带宽内存(HBM)以满足不断增长的AI驱动的需求。 The new plant, similar in size to Micron’s existing Miaoli fab, will produce advanced DRAM and high-bandwidth memory (HBM) to meet growing AI-driven demand. 2026财政年度结束时开始施工,预计2028财政年度将交付产品。 Construction begins by the end of fiscal 2026, with product shipments expected by fiscal 2028. 这一举动加强了微小公司在台湾的制造业存在,并支持其最先进的记忆技术的全球供应链。 The move strengthens Micron’s manufacturing presence in Taiwan and supports its global supply chain for cutting-edge memory technologies.