尽管欧盟关系紧张,且BESI宣称具有独立性,但美国公司仍试图以其与AI有关的关键包装技术获得荷兰的制造芯片者BESI。 U.S. firms seek to acquire Dutch chipmaker BESI over its key AI-related packaging tech, despite EU tensions and BESI’s stated independence.

BE 半导体工业公司是荷兰的芯片设备制造商,价值140亿欧元,在对AI和高性能计算中使用的高级芯片包装的需求激增的情况下,正在从美国Lam Research and Application Materials公司获取收购权。 BE Semiconductor Industries, a Dutch chip equipment maker valued at €14 billion, is drawing takeover interest from U.S. firms Lam Research and Applied Materials amid surging demand for advanced chip packaging used in AI and high-performance computing. Morgan Stanley自2025年年中以来一直向BESI提供咨询意见,2026年早些时候,由于美国-欧盟在格陵兰问题上的紧张局势,会谈暂停,尽管此后恢复了。 Morgan Stanley has advised BESI since mid-2025, with talks pausing earlier in 2026 due to U.S.-EU tensions over Greenland, though they have since resumed. BESI的混合联结技术使得芯片连接速度更快、效率更高,因此被视为克服工业瓶颈的关键。 BESI’s hybrid bonding technology, which enables faster, more efficient chip connections, is seen as vital in overcoming industry bottlenecks. 该公司重申其2024年对独立的承诺,但战略利益依然很高。 The company reaffirmed its 2024 commitment to independence, but strategic interest remains high. BESI、摩根斯坦利和应用材料公司拒绝评论;Lam Research公司没有答复。 BESI, Morgan Stanley, and Applied Materials declined to comment; Lam Research did not respond.