UMC、HyperLight和Wavetek发射大规模生产TFLN芯片,以便更快、更高效的AI和数据中心光学。 UMC, HyperLight, and Wavetek launch mass production of TFLN chiplets for faster, more efficient AI and data center optics.

联合微电子公司 (UMC) 与HyperLight和Wavetek合作,共同发起了一项计划,用于大规模生产薄膜酸 (TFLN) 片,用于人工智能和数据中心应用中的高速光学互连. United Microelectronics Corporation (UMC), in partnership with HyperLight and Wavetek, has launched a joint effort to mass-produce thin-film lithium niobate (TFLN) chiplets for high-speed optical interconnects in AI and data center applications. 合作利用UMC的8英寸长的瓦法制造和Wavetek的6英寸CMOS技术专长,利用标准化的高容量工艺,将TFLN光子放大规模。 The collaboration leverages UMC’s 8-inch wafer manufacturing and Wavetek’s 6-inch CMOS expertise to scale TFLN photonics using standardized, high-volume processes. 该倡议旨在提供能支持1.6T以上数据率的节能高带宽光学解决方案,满足对AI基础设施中更快、低纬度数据传输日益增加的需求。 The initiative aims to deliver energy-efficient, high-bandwidth optical solutions capable of supporting data rates beyond 1.6T, addressing growing demands for faster, lower-latency data transfer in AI infrastructure. 该平台将短距离、长距离和共同包装的光学整合为单一的可扩展架构,加快了TFLN从利基技术向云层和网络系统主流使用的过渡。 The platform integrates short-reach, long-reach, and co-packaged optics into a single scalable architecture, accelerating TFLN’s transition from niche technology to mainstream use in cloud and networking systems.