Manz Asia和Epson伙伴推进半导体制造的喷墨技术,使先进芯片部件能够精确、可扩展的生产。 Manz Asia and Epson partner to advance inkjet tech for semiconductor manufacturing, enabling precise, scalable production of advanced chip components.

Manz Asia和Epson结成了战略伙伴关系,开发先进的半导体制造墨喷系统,将Epson的精密印刷头技术与Manz Asia的设备工程结合起来。 Manz Asia and Epson have formed a strategic partnership to develop advanced inkjet systems for semiconductor manufacturing, combining Epson’s precision printhead technology with Manz Asia’s equipment engineering. 合作的重点是在RFIC、PMIC和CPO设备中为2.5D/3D天线痕量、热层和连接层提供可缩放的实验室对面解决办法。 The collaboration focuses on scalable Lab-to-Fab solutions for 2.5D/3D antenna traces, heatsinks, and bonding layers in RFIC, PMIC, and CPO devices. 联合系统能够准确印刷不同表面的导电、光阻和功能墨水,支持研究、试点生产和大规模制造。 The joint systems enable precise printing of conductive, photoresist, and functional inks across diverse surfaces, supporting research, pilot production, and mass manufacturing. 以台湾为基地的研发枢纽与材料和技术伙伴一起促进创新,目的是加快市场到市场的时间,提高生产效率。 Based in Taiwan, the R&D hub fosters innovation with materials and technology partners, aiming to accelerate time-to-market and improve production efficiency. 联盟强调数字添加剂制造业在促成可持续、灵活和高精度半导体包装方面的作用。 The alliance emphasizes digital additive manufacturing’s role in enabling sustainable, flexible, and high-precision semiconductor packaging.