到2027年,印度将芯片组装和测试扩大到每天7 500万至8 000万个单位,使用进口的卷饼出口。 India expands chip assembly and testing to 75–80 million units daily by 2027, using imported wafers for export.

印度正在迅速扩大其半导体能力,到2026年底或2027年初,在Micron、Tata等新设施驱动下,每天将7 500万至8 000万芯片用于组装和试验。 India is rapidly expanding its semiconductor capabilities, targeting 75 to 80 million chips per day in assembly and testing by late 2026 or early 2027, driven by new facilities from Micron, Tata, and others. 这些工厂的重点是低风险的ATMP操作,将处理进口的卷饼,为AI、汽车和消费电子产品生产芯片。 Focused on lower-risk ATMP operations, these plants will process imported wafers, producing chips for AI, automotive, and consumer electronics. 类似ISM 2.0等政府计划正在提升基础设施和国内设计人才。 While wafer fabrication remains absent, government programs like ISM 2.0 are boosting infrastructure and domestic design talent. 推力旨在将印度纳入全球半导体供应链,预计出口产出最多。 The push aims to integrate India into the global semiconductor supply chain, with most output expected for export.