TANAKA开发了用于精密半导体的新的金块转移技术,使小型、更可靠的电子设备成为可能。 TANAKA develops new gold bump transfer tech for delicate semiconductors, enabling smaller, more reliable electronics.

TANAKA 稀有金属技术为其AuRoFUSETM预型开发了一种新的转让方法,使得能够在复杂或微妙的半导体表面形成精确的金块。 TANAKA Precious Metal Technologies has developed a new transfer method for its AuRoFUSE™ Preforms, enabling precise gold bump formation on complex or delicate semiconductor surfaces. 该工艺在硅转移基板上制造带有蚀刻开口的凸起，在加工过程中固定这些凸起，并通过热收缩释放，通过150°C和10 MPa的热压缩键合转移，最终在200°C和20 MPa的结合。 The process creates bumps on a silicon transfer substrate with etched openings, secures them during processing, and uses heat-induced shrinkage to release them for transfer via thermocompression bonding at 150°C and 10 MPa, followed by final bonding at 200°C and 20 MPa. 这克服了在不规则或敏感基底上直接碰撞和光刻的限制，提供了坚固、稳定、低变形的结合，非常适合智能手机、LED、汽车电子和微机系统（MEMS）中的高密度集成。 This overcomes limitations of direct bumping and photolithography on irregular or sensitive substrates, offering strong, stable, low-deformation bonds ideal for high-density integration in smartphones, LEDs, automotive electronics, and MEMS. 该技术避免了焊接短路和电镀损坏,支持下一代微型化电子产品和光子集成。 The technology avoids soldering short circuits and plating damage, supporting next-generation miniaturized electronics and photonics integration.