TECNO在2026年的MWC展示了一台4.9毫米长的模块式智能手机,配有可定制模块的磁和柔性附加装置。 TECNO unveiled a 4.9mm-thin, modular smartphone at MWC 2026 with magnetic and pogo-pin attachments for customizable modules.

TECNO在2026年的MWC引入了4.9mm-Thin模块式智能手机概念,其特点是可互换模块的磁连接和波段连接。 TECNO has introduced a 4.9mm-thin modular smartphone concept at MWC 2026, featuring magnetic and pogo-pin connections for interchangeable modules. 该系统支持4.5毫米电池包、显示图案的摄像模块等配件,以及AI、储存和生活方式功能的未来扩展。 The system supports accessories like a 4.5mm battery pack, camera modules with display viewfinders, and future expansions for AI, storage, and lifestyle functions. 该平台使用Wi-Fi、蓝牙和mmWave,确保快速数据和电源传输。 Using Wi-Fi, Bluetooth, and mmWave, the platform ensures fast data and power transfer. 该设计包括八个附件区和两个审美版,强调用户定制和适应性。 The design includes eight attachment zones and two aesthetic editions, emphasizing user customization and adaptability. 该架构虽然专有,但着眼于未来的兼容性,将这一概念定位为满足不断演变的智能手机需要的灵活解决办法。 While proprietary, the architecture aims for future compatibility, positioning the concept as a flexible solution for evolving smartphone needs.