总理莫迪(Modi)于2026年2月21日在北方邦参加HCL-Foxconn半导体工厂的开创性活动。 Prime Minister Modi to virtually attend groundbreaking of HCL-Foxconn semiconductor plant in Uttar Pradesh on Feb. 21, 2026.

总理莫迪(Narendra Modi)将出席2026年2月21日在北方邦犹太人举行的HCL-Foxconn半导体项目的开创性仪式。 Prime Minister Narendra Modi will virtually attend the groundbreaking ceremony for the HCL-Foxconn semiconductor project in Jewar, Uttar Pradesh, on February 21, 2026. 3 700卢比外包半导体组装和测试(OSAT)设施是印度经过修改的半导体ATMP计划的一部分,将生产智能手机、膝上型计算机和汽车电子设备的显示驱动器集成电路。 The Rs 3,700 crore Outsourced Semiconductor Assembly and Test (OSAT) facility, part of India’s Modified Scheme for Semiconductor ATMP, will produce display driver integrated circuits for smartphones, laptops, and automotive electronics. 该项目位于Noida国际机场附近,目的是促进国内制造业,减少对进口的依赖,创造数千个就业机会。 The project, located near the Noida International Airport, aims to boost domestic manufacturing, reduce import dependence, and create thousands of jobs. 它支持印度推动技术自力更生,并加强其在全球电子供应链中的作用。 It supports India’s push for technological self-reliance and strengthens its role in global electronics supply chains. 同一天,在印度AI影响峰会期间,Modi与技术领袖Sam Altman和Cristiano Amon举行了双边会晤。 On the same day, Modi held bilateral meetings with tech leaders Sam Altman and Cristiano Amon during the India AI Impact Summit.