2025年,由于AI和数据中心的需求,全球硅裂谷货运量增加,但收入在价格压力下下降。 Global silicon wafer shipments rose in 2025 due to AI and data center demand, but revenue fell amid pricing pressures.

全球晶片出货量在2025年增长5.8%,达到1297万平方英寸,这是由于人工智能和数据中心应用中对先进晶片的强需求,特别是用于高带宽内存和逻辑芯片的300mm晶片. Global silicon wafer shipments rose 5.8% to 12,973 million square inches in 2025, driven by strong demand for advanced wafers in AI and data center applications, particularly 300mm wafers for high-bandwidth memory and logic chips. 尽管货运量增长,由于传统半导体用途需求疲软和持续定价压力,瓦弗公司收入下降了1.2%,降至114亿美元。 Despite the shipment growth, wafer revenue fell 1.2% to $11.4 billion due to weak demand in traditional semiconductor uses and ongoing pricing pressures. 运输量的增加主要得益于采用子3nm工艺,以及对基因人工智能和高性能计算的投资增加。 The increase in shipments was largely fueled by adoption of sub-3nm processes and rising investments in generative AI and high-performance computing.