Montage Technology的香港首发版爆发了64%, 因为它筹集了11亿美元, Montage Technology's Hong Kong debut surged 64% as it raised $1.1 billion, fueled by strong demand and China's push for semiconductor independence.

中国半导体公司Montaage Technology在2026年2月9日的香港股市首期上市中猛涨64%, Chinese semiconductor firm Montage Technology surged 64% in its Hong Kong stock market debut on February 9, 2026, closing at HK$175 after opening at HK$168, the top of its offer range. 该公司在二级上市中筹集了70.4亿港元(11亿美元),零售超额订阅超过700倍,国际利息超过37倍,这凸显了强劲的需求。 The company raised HK$7.04 billion ($1.1 billion) in a secondary listing, with strong demand highlighted by a retail oversubscription exceeding 700 times and international interest over 37 times. 这些资金将支持研究与发展、商业化和战略投资。 The funds will support R&D, commercialization, and strategic investments. Montage是世界上最大的内存连接芯片供应商,在2024年占市场份额的36.8%,据报告,在2025年9月结束的9个月中,收入增长58%,净利润增长64%。 Montage, the world’s largest memory interconnect chip supplier with a 36.8% market share in 2024, reported a 58% revenue increase and 64% net profit growth in the nine months ending September 2025. 名单反映了投资者在美国出口限制和北京推动技术自给自足的背景下,对中国的AI和半导体部门的兴趣日益浓厚。 The listing reflects growing investor interest in China’s AI and semiconductor sector amid U.S. export restrictions and Beijing’s push for technological self-sufficiency.