OpenAI在2026年后期发射人工耳膜, 使用 2nm 芯片和云基人工智能进行语音任务。 OpenAI to launch AI earbuds in late 2026, using a 2nm chip and cloud-based AI for voice tasks.

OpenAI预定在2026年末推出第一件硬件产品, 即AI动力耳膜代号为“Dime”, OpenAI is set to launch its first hardware product, AI-powered earbuds codenamed "Dime," by late 2026, marking its initial foray into consumer devices. 耳塞由越南富士康公司制造,采用2纳米芯片,将运行在OpenAI的AI模型上,并以云计算处理为主,专注于语音交互. The earbuds, being made by Foxconn in Vietnam and featuring a 2nm chip, will run on OpenAI’s AI model with cloud-based processing and focus on voice interactions. 由于高成本和供应链问题,特别是高带宽内存问题,诸如笔形人工智能装置等更先进的装置的早期计划被推迟。 Earlier plans for more advanced devices like a pen-shaped AI gadget have been delayed due to high costs and supply chain issues, particularly with high-bandwidth memory. 与CEO Sam Altman对无缝、无侵扰性人工智能经验的愿景一致。 The product reflects a strategic shift toward simpler, lower-risk hardware, aligning with CEO Sam Altman’s vision for seamless, non-intrusive AI experiences.