FIC Global在新加坡2026年亚洲摄影展上揭开800G和1.6T光学收发器的先进包装,提高了AI驱动数据中心的性能。 FIC Global unveils advanced packaging for 800G and 1.6T optical transceivers at Singapore’s Asia Photonics Expo 2026, boosting AI-driven data center performance.

FIC Global在其PRIME Technology品牌下,正在新加坡2026年2月4日至6日亚洲摄影博览会上展示高速光学收发器的先进包装解决方案。 FIC Global, under its PRIME Technology brand, is showcasing advanced packaging solutions for high-speed optical transceivers at the Asia Photonics Expo 2026 in Singapore, February 4–6. 该公司正在支持由AI驱动的向800G和1.6T早期数据中心互联的转变,利用了18年多在Flip-Chip、COB、硅光子和共同包件光学方面的经验和能力。 The company is supporting the shift toward 800G and early 1.6T data center interconnects driven by AI, leveraging over 18 years of experience and capabilities in Flip-Chip, COB, Silicon Photonics, and Co-Packaged Optics. 联合会强调能源效率、高速信号工程和可靠性,以减少合格时间,提高生产稳定性。 FICG emphasizes energy efficiency, high-speed signal engineering, and reliability to reduce qualification times and improve production stability. 马来西亚正在扩大制造业,以提高供应链的抗御力和能力。 It is expanding manufacturing in Malaysia to enhance supply chain resilience and capacity.