ADLINK为坚固的工业边缘装置推出了新的AI-动力计算机模块,开发工具包应于2026年Q2中提供。 ADLINK launches new AI-powered computer modules for rugged industrial edge devices, with development kits due in Q2 2026.

ADLINK已经启动了Express-PTL,这是其第一个基于英特尔核心Ultra系列3处理器的模块计算机,针对坚硬工业边缘的AI应用。 ADLINK has launched the Express-PTL, its first computer-on-module based on Intel Core Ultra Series 3 processors, targeting rugged industrial edge AI applications. 以红豹湖H系列硅的COM Express形式因子为基础,它通过混合的16个核心CPU、Intel Xe3 GPU和NPU 5.0提供高达180个AI性能托普。 Built on the COM Express form factor with Panther Lake H-series silicon, it delivers up to 180 TOPS of AI performance via a hybrid 16-core CPU, Intel Xe3 GPU, and NPU 5.0. 它支持多达128GB的DDCP5内存,包括SSN Ethernet,在至40摄氏度至85摄氏度的极端温度下运作。 It supports up to 128 GB of DDR5 memory, includes TSN Ethernet, and operates in extreme temperatures from -40°C to 85°C. 该公司还引进了相关产品——COM-HPC-mPTL、SBC35-PTL和MXE-330,用于机器人、自动化、医疗成像和自主系统中的紧凑任务关键部署。 The company also introduced related products—COM-HPC-mPTL, SBC35-PTL, and MXE-330—for compact, mission-critical deployments in robotics, automation, medical imaging, and autonomous systems. 预计2026年第二季度将发布快速-PTL和COM-HPC-mPTL开发套件. Development kits for Express-PTL and COM-HPC-mPTL are expected in Q2 2026.