SK Hynix将投资12.9B 用于韩国新的HBM芯片设施,2026年4月启动。 SK Hynix to invest $12.9B in new HBM chip facility in South Korea, launching April 2026.

在南韩的忠州,SK Hynix公司打算投资129亿美元(19万亿韩元),用于一个新的先进的芯片包装和测试设施。 In Cheongju, South Korea, SK Hynix intends to invest $12.9 billion (19 trillion won) in a new advanced chip packaging and testing facility. 工作定于2026年4月开始,2027年底完成。 Work is scheduled to begin in April 2026 and be finished by late 2027. 随着全世界对高带内存(HBM)芯片的需求上升,该项目力求增加这些芯片的产量。 As demand for high-bandwidth memory (HBM) chips rises worldwide, the project seeks to increase production of these chips. 通过将测试和包装与目前的卷饼制造结合起来,该设施将提高生产力,并满足由AI驱动的日益增长的需求。 By integrating testing and packaging with current wafer fabrication, the facility will boost productivity and meet growing AI-driven demand. 由于预计到2030年,HBM市场年增长率将达到33%,Nvidia最大的HBM供应商SK Hynix在2025年将占61%的市场份额,预计这项投资将提升其地位。 With a projected 33% annual growth in the HBM market through 2030, SK Hynix, Nvidia's top HBM supplier with a 61% market share in 2025, anticipates the investment will bolster its position.