Cadence在CES 2026与Arm和三星公司一起在CES 2026启动了一个芯片平台,以加快人工智能和计算芯片的开发。 Cadence launched a chiplet platform at CES 2026 with Arm and Samsung to speed AI and computing chip development.

Cadence在CES 2026上揭开了一个新的芯片生态系统,与Arm、Samsung Foundry等合作,为实物人工智能、数据中心和高性能计算提供经过预先验证的综合芯片。 Cadence unveiled a new chiplet ecosystem at CES 2026, partnering with Arm, Samsung Foundry, and others to deliver pre-validated, integrated chiplets for physical AI, data centers, and high-performance computing. 该平台以Cadence的物理人工智能技术为基础,并在三星的SF5A工艺上得到验证,支持UCIe、PCIe 7.0和HBM4等行业标准,其工具可以进行自动化设计和实时核查。 The platform, built on Cadence’s Physical AI technology and validated on Samsung’s SF5A process, supports industry standards like UCIe, PCIe 7.0, and HBM4, with tools enabling automated design and real-time verification. 其目的是减少复杂性,加快在汽车、机器人、云和高电联应用的市场营销时间。 It aims to reduce complexity and accelerate time to market for applications in automotive, robotics, cloud, and HPC.