Innodisk 发射 AI-howed EXMP-Q911 模块,100 TOPS 性能用于边缘计算 。 Innodisk launches AI-powered EXMP-Q911 module with 100 TOPS performance for edge computing.

Innodisk 已经启动了 EXMP-Q911 COM-HPC Mini 模块, 由Qualcomm 的龙翼 IQ- 9075 SoC 驱动, 与类似的模块相比, 提供了高达100个 TOPS 的 AI 性能和10% 的推断速度。 Innodisk has launched the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm’s Dragonwing IQ-9075 SoC, delivering up to 100 TOPS of AI performance and 10% higher inference speed than similar modules. 该模块包括8个核心Kryo CPU、Adreno 663 GPU、36GB LPDDCP5X内存、128GB UFS 3.1 储存和高级接口,包括PCIe Gen4和双型2.5GbE局域网。 The module features an 8-core Kryo CPU, Adreno 663 GPU, 36GB LPDDR5X memory, 128GB UFS 3.1 storage, and advanced interfaces including PCIe Gen4 and dual 2.5GbE LAN. 它设计用于边缘AI应用,支持工业自动化、智能城市和AGV/AMRs。 Designed for edge AI applications, it supports industrial automation, smart cities, and AGVs/AMRs. Innodisk提供IQ Studio和 ICAP等软件工具,用于简化开发和远程管理。 Innodisk provides software tools like IQ Studio and iCAP for streamlined development and remote management. 该合作伙伴计划扩展到未来的Dragonwing SoC,并支持预先验证的载波板和外设. The partnership plans to expand to future Dragonwing SoCs, with support for pre-validated carrier boards and peripherals.