AMD和Intel披露了2026年CES的新的AI-优化型笔记本电脑芯片,提高了性能和电池寿命。 AMD and Intel unveiled new AI-optimized laptop chips at CES 2026, boosting performance and battery life.

在2026年CES会议上,AMD发射了其Ryzen AI 400系列膝上型计算机处理器,其特点是Zen 5 CPUs、RDNA 3.5 图形和XDNA 2 NPUs,其性能可达60倍,通过FSR Redstone提供了更高的效率、更快的多重任务和增强的游戏。 At CES 2026, AMD launched its Ryzen AI 400 series laptop processors, featuring Zen 5 CPUs, RDNA 3.5 graphics, and XDNA 2 NPUs with up to 60 TOPS of AI performance, offering improved efficiency, faster multitasking, and enhanced gaming via FSR Redstone. Ryzen AI 9 HX 475在排队中领先,有12个核心和60个TOPS,保证电池寿命达24小时。 The Ryzen AI 9 HX 475 leads the lineup with 12 cores and 60 TOPS, promising up to 24 hours of battery life. AMD还推出了新的Ryzen AI Max+模型,有40个GPU核心和共享记忆支持,针对的是创造性的亲利和当地AI工作量。 AMD also introduced new Ryzen AI Max+ models with 40 GPU cores and shared memory support, targeting creative pros and local AI workloads. GIGABYTE公布了Ryzen 9000 X3D CPU的AI-动力X3D Turbo 模式2.0,通过实时调节提高性能。 GIGABYTE unveiled AI-powered X3D Turbo Mode 2.0 for Ryzen 9000 X3D CPUs, enhancing performance through real-time tuning. 英特尔推出了 Panther Lake 芯片,其处理器为 18a,50 TOPS NPU,游戏速度高达 77%,设备将于 1 月 27 日推出. Intel unveiled its Panther Lake chips with 18a process, 50 TOPS NPU, and up to 77% faster gaming, with devices launching January 27. 与新芯片搭配的笔记本电脑预计将在2026年Q1。 Laptops with the new chips are expected in Q1 2026.