TSMC于2025年底开始大规模生产2nm芯片,使AI和移动装置的性能和效率大增。 TSMC started mass-producing 2nm chips in late 2025, offering major gains in performance and efficiency for AI and mobile devices.

TSMC于2025年4月在Koohsiung Fab 22号用第一代纳米晶体管开始大规模生产其2nm芯片。 TSMC began mass production of its 2nm chips in Q4 2025 at its Kaohsiung Fab 22, using first-generation nanosheet transistors. N2工艺的性能比N3E 3nm节点高1015%或低2530%,晶体管密度超过15%。 The N2 process delivers 10%–15% higher performance or 25%–30% lower power than its N3E 3nm node, with over 15% greater transistor density. 这一进展支持了对人工智能和移动设备中高效计算日益增长的需要。 The advancement supports growing needs for efficient computing in AI and mobile devices. TSMC正在开发N2P变体,预计2026年底大规模生产。 TSMC is already developing the N2P variant, expected for mass production in late 2026.