苹果面临2026年iPhone模型芯片短缺, Apple faces chip shortages for 2026 iPhone models due to production limits despite securing most of TSMC’s 2nm capacity.

苹果在即将到来的A20和A20 Pro芯片上面临芯片短缺,尽管TSMC为iPhone 18和iPhone Fold(定于2026年底启动)获得了超过一半的2nm生产能力。 Apple faces chip shortages for its upcoming A20 and A20 Pro chips, despite securing over half of TSMC’s 2nm production capacity for the iPhone 18 and iPhone Fold, set to launch in late 2026. 生产限制和高需求正在限制供应,有可能影响到装置的可用性。 Production constraints and high demand are limiting supply, potentially affecting device availability. 芯片将使用TSMC的2nm工艺和新的瓦法级包装方法整合内存、提高性能和效率。 The chips will use TSMC’s 2nm process and a new wafer-level packaging method to integrate RAM, boosting performance and efficiency. 尽管三星在2nm技术上取得了进步, 但苹果依然致力于将TSMC作为唯一的铸造伙伴, Apple remains committed to TSMC as its sole foundry partner, citing superior yields and reliability, despite Samsung’s progress in 2nm technology.