中国芯片制造商Biren在美国的限制下在香港的IPO筹集624M美元, Chinese chipmaker Biren raises $624M in Hong Kong IPO amid U.S. restrictions, aiming to boost AI and semiconductor innovation despite massive losses.

中国芯片制造商,包括Biren Technology,正在加快香港和上海的IPO计划,以确保在美国出口限制下为AI和半导体创新提供资金。 Chinese chipmakers, including Biren Technology, are accelerating IPO plans in Hong Kong and Shanghai to secure funding for AI and semiconductor innovation amid U.S. export restrictions. 中国第一个在香港上市的GPU开发商Biren在投资者的有力支持下,正在筹集6.24亿美元,尽管在2025年初报告损失近12亿美元。 Biren, China’s first GPU developer to go public in Hong Kong, is raising up to $624 million with strong investor backing, though it reported a nearly $1.2 billion loss in early 2025. 随着上海成功上市, 幅也反映出中国在技术自力更生方面所做的努力, 分析师预测中国芯片很快将会挑战像英伟达这样的全球领导者. The surge follows successful Shanghai listings and reflects China’s broader push for tech self-reliance, with analysts predicting Chinese chips could soon challenge global leaders like Nvidia.