中国人工智能芯片制造商Biren计划于2025年12月在香港投资促进组织(IPO)募集300万美元。 Chinese AI chipmaker Biren plans a Dec. 2025 Hong Kong IPO, aiming to raise $300M.

中国人工智能芯片启动公司Biren Technology计划于2025年12月在香港启动首期公开发行, Chinese AI chip startup Biren Technology plans to launch an initial public offering in Hong Kong in December 2025, potentially raising $300 million by issuing up to 372.5 million shares, according to sources. 该公司成立于2019年,由SenseTime公司、Qualcomm公司和Huawei公司前董事长创立,目的是早在12月就将现有的岸上股票转为香港上市股票。 The company, founded in 2019 by former executives from SenseTime, Qualcomm, and Huawei, aims to list as early as December, with existing onshore shares converted to Hong Kong-listed stock. IPO遵循摩尔线和MetaX等同行强劲的市场表现。 The IPO follows strong market performance by peers like Moore Threads and MetaX. Biren在2025年一轮筹资之前价值约20亿美元,被加入美国。 Biren, valued at about $2 billion before a 2025 funding round, was added to the U.S. 2023年实体清单,限制进入先进的芯片制造。 Entity List in 2023, limiting access to advanced chip manufacturing. 中国证券监管委员会已确认其提交。 The China Securities Regulatory Commission has acknowledged its filing. 中国国际银行、CICC和Ping An证券正在主导这一交易。 Bank of China International, CICC, and Ping An Securities are leading the deal.