香港主办首届2025年半导体峰会,展示创新和全球合作。 Hong Kong hosts first 2025 Semiconductor Summit, showcasing innovation and global collaboration.

香港科学技术大学和SEMI于2025年12月5日在香港举行了首届2025年半导体创新和智能应用峰会,吸引了来自工业、学术界、政府和投资部门的600多名全球领导人参加。 The Hong Kong University of Science and Technology and SEMI held the first 2025 Semiconductor Innovation and Intelligent Application Summit in Hong Kong on December 5, 2025, drawing over 600 global leaders from industry, academia, government, and investment sectors. 在香港特区政府的支持下,这次活动突出了新兴的半导体技术、跨部门合作以及香港作为国际创新枢纽的日益增长的作用。 Supported by the HKSAR Government, the event highlighted emerging semiconductor technologies, cross-sector collaboration, and Hong Kong’s growing role as an international innovation hub. HKST展示了对智能康复机器人的研究,新一代使用量子点的AR显示器,以及节能芯片。 HKUST showcased research in smart rehabilitation robotics, next-generation AR displays using quantum dots, and energy-efficient chips. 峰会包括为学生举办STEM讲习班,强调推进第三代半导体和大湾地区一体化。 The summit included STEM workshops for students and emphasized advancing third-generation semiconductors and Greater Bay Area integration.