印度通过从学术机构制造56个芯片设计,在2025年11月向学生分发了28个芯片,从而推进了其半导体目标。 India advanced its semiconductor goals by fabricating 56 chip designs from academic institutions, distributing 28 chips to students in Nov 2025.

印度在其半导体野心方面取得了进展,46个学术机构通过芯片启动方案提交了122个芯片设计,其中56个是利用180nm技术在Mohali的半导体实验室成功制造的。 India has made progress in its semiconductor ambitions, with 122 chip designs submitted by 46 academic institutions through the Chips to Start-up (C2S) Programme, 56 of which were successfully fabricated at the Semiconductor Laboratory in Mohali using 180nm technology. 班加罗尔的ChipIN中心通过提供设计工具、辅导和基础设施,使批量制造每三个月能够降低成本,为这一进程提供了便利。 The ChipIN Centre in Bangalore facilitated the process by providing design tools, mentorship, and infrastructure, enabling batch fabrication every three months to reduce costs. 联盟部长Ashwini Vaishnaw于2025年11月将28个木制芯片(600个赤身死亡和600个包装芯片)交给了17个机构的学生。 Union Minister Ashwini Vaishnaw handed over 28 fabricated chips—600 bare dies and 600 packaged chips—to students from 17 institutions in November 2025. 该倡议是全国推动战略电子学自力更生的一部分,已经吸引了100 000多名学生和90个新开办企业,标志着世界上最大的中央芯片设计设施之一。 The initiative, part of a national push for self-reliance in strategic electronics, has engaged over 100,000 students and 90 startups, marking one of the world’s largest centralized chip design facilities.