2027年到28年在北海道建造第二家芯片厂的日本拉皮图斯(Rapidus)在2027年到28年在北海道建造第二家芯片厂,目标是到2029年制造1.4毫米芯片。 Japan’s Rapidus to build second chip plant in Hokkaido by 2027–28, targeting 1.4-nm chips by 2029.

日本芯片制造商Rapidus在索尼、丰田、IBM和政府的支持下,计划从2027-28财政年度开始在北海道建造第二个先进的半导体工厂,目标是在2029年前生产1.4纳米芯片。 Japanese chipmaker Rapidus, backed by Sony, Toyota, IBM, and the government, plans to build a second advanced semiconductor factory in Hokkaido starting in the 2027–28 financial year, aiming to produce 1.4-nanometre chips by 2029. 由Nikkei Asia和Hokaido Shimbun所报导的该项目支持日本大力加强国内芯片生产并减少对外国供应商的依赖。 The project, reported by Nikkei Asia and Hokkaido Shimbun, supports Japan’s push to strengthen domestic chip production and reduce reliance on foreign suppliers. 虽然Ratidus尚未正式确认第二厂,但它承认媒体报道可能是推测性的,并说它将迅速宣布任何官方计划。 While Rapidus has not officially confirmed the second plant, it acknowledged media reports may be speculative and said it will announce any official plans promptly. 该设施将侧重于尖端芯片制造,利用单蒸馏处理和内部组装来提高效率。 The facility will focus on cutting-edge chip manufacturing using single-wafer processing and in-house assembly to improve efficiency. 这一努力是更广泛的战略的一部分,目的是在地缘政治和技术压力不断上升的情况下,与诸如TSMC、Samsung和Intel等全球领导人竞争。 This effort is part of a broader strategy to compete with global leaders like TSMC, Samsung, and Intel amid rising geopolitical and technological pressures.