美国立法者于2025年11月20日推出了《芯片EQUIP法》,以阻止《CHIPS法》给予接受者购买中国制造的半导体设备,而不顾国家安全考虑。 U.S. lawmakers introduced the Chip EQUIP Act on Nov. 20, 2025, to block CHIPS Act grant recipients from buying Chinese-made semiconductor equipment over national security concerns.

2025年11月20日, 美国立法者推出《Chip EQUIP法案》, 提议以国家安全和供应链风险为由, 阻止接受CHIPS法案赠款的公司购买在中国制造的半导体制造设备。 On November 20, 2025, U.S. lawmakers introduced the Chip EQUIP Act, proposing to block companies receiving CHIPS Act grants from buying semiconductor manufacturing equipment made in China, citing national security and supply chain risks. 由洛夫格伦和奥伯诺尔特共和国领导的两党法案旨在防止向敌对国家转让技术,并加强国内芯片生产。 The bipartisan bill, led by Reps. Lofgren and Obernolte, aims to prevent technology transfer to adversarial nations and strengthen domestic chip production. 专家们还警告说,现有的出口管制存在漏洞,使中国能够通过盟国获得关键设备,破坏了美国限制北京技术进步的努力。 Experts also warned that existing export controls have loopholes allowing China to acquire critical equipment through allied nations, undermining U.S. efforts to limit Beijing’s technological advancement.