BAE系统为空间推出了一个升级的辐射加固12nm芯片平台,使美国民用、商用和防御飞行任务能够更快、安全、低功率地开发芯片。 BAE Systems launched an upgraded radiation-hardened 12nm chip platform for space, enabling faster, secure, low-power chip development for U.S. civil, commercial, and defense missions.

BAE系统已经更新了其RH12仓库,这是一个用于空间飞行任务的辐射加固的12nm芯片平台,提供了一个预先合格的知识产权核心库和设计工具。 BAE Systems has upgraded its RH12 Storefront, a radiation-hardened 12nm chip platform for space missions, offering a library of pre-qualified intellectual property cores and design tools. 该平台能够利用商业铸造技术,更快地开发民用、商业和国防空间应用的定制、高性能、低功率系统芯片解决方案。 The platform enables faster development of custom, high-performance, low-power system-on-chip solutions for civil, commercial, and defense space applications using commercial foundry technology. 该平台与包括Cadence、Rambus和Spectral在内的合作伙伴一起开发,按照美国国防部在弗吉尼亚的受信任来源标准制造,支持先进的IP,如处理器、接口和评价阶段的模拟数字转换器等。 Developed with partners including Cadence, Rambus, and Spectral, and manufactured under U.S. Department of Defense Trusted Source standards in Virginia, the platform supports advanced IP like processors, interfaces, and evaluation-stage analog-to-digital converters. 初步开发工具包已备妥,资格认证工作正在进行当中。 Initial development kits are available, with full qualification ongoing.