ACM 研究推进 AI 芯片包装技术,聚焦于2.5D/3D集成,以便更快、更高效的处理器。 ACM Research advances AI chip packaging tech, spotlighting 2.5D/3D integration for faster, more efficient processors.

ACM研究主管强调了AI芯片包装的进步,强调2.5D和3D集成对于下一代AI处理器的性能、功率效率和密度越来越重要。 ACM Research executives highlighted advancements in AI chip packaging, emphasizing the growing importance of 2.5D and 3D integration for performance, power efficiency, and density in next-generation AI processors. 该公司的设备正被用于高带宽内存和对AI加速器至关重要的多芯片模块设计,并被全球主要的半导体制造商采用。 The company's equipment is being used in high-bandwidth memory and multi-chip module designs critical for AI accelerators, with adoption by leading global semiconductor manufacturers. 虽然没有公布客户名字或财务数据,但ACMR指出,随着传统制造市场的成熟,目前正在进行研发投资,并朝高价值包装技术的战略转变. While no customer names or financial figures were shared, ACMR noted ongoing R&D investments and a strategic shift toward high-value packaging technology as traditional fabrication markets mature. 这些评论反映出整个行业都认识到包装现在是一个关键的性能差异因素。 The remarks reflect industry-wide recognition that packaging is now a key performance differentiator.