马来西亚在半导体组装、测试和包装方面位居全球第6位,计划扩大到高价值前端制造。 Malaysia ranks 6th globally in semiconductor assembly, testing, and packaging, with plans to expand into high-value front-end manufacturing.

马来西亚巩固了其作为半导体组装、测试和包装的全球顶级枢纽的地位,在全世界排名第六,占全球容量的13%。 Malaysia has solidified its position as a top global hub for semiconductor assembly, testing, and packaging, ranking sixth worldwide with 13% of global capacity. 其成功来源于数十年来由LAM研究和应用材料公司等公司的外国投资建立的强大机械和设备(M&E)生态系统,使当地企业能够发展成为先进的工程伙伴。 Its success stems from a decades-long, robust Machinery and Equipment (M&E) ecosystem built through foreign investments from companies like LAM Research and Applied Materials, enabling local firms to evolve into advanced engineering partners. 在包括《2030年新工业总计划》和《国家半导体战略》在内的国家战略的支持下,马来西亚现在正在向高价值前端制造业扩展。 Supported by national strategies including the New Industrial Master Plan 2030 and the National Semiconductor Strategy, Malaysia is now expanding into higher-value front-end manufacturing. 马来西亚投资发展局(MIDA)正在推动这一转变,吸引全球创新者,促进技术转让,并通过SEMICON东南亚2025等活动将当地供应商纳入全球供应链,目的是将马来西亚从供应商基地转变为半导体工业的战略创新中心。 The Malaysian Investment Development Authority (MIDA) is driving this shift by attracting global innovators, promoting technology transfer, and integrating local suppliers into global supply chains through events like SEMICON Southeast Asia 2025, aiming to transform Malaysia from a supplier base into a strategic innovation hub in the semiconductor industry.