印度于2025年11月1日在布巴内斯瓦尔启动了第一座碳化硅芯片厂,以促进国内半导体生产。 India launched its first silicon carbide chip plant in Bhubaneswar on Nov. 1, 2025, to boost domestic semiconductor production.

2025年11月1日,印度开始在Odisha的Bhubaneswar建造其第一个综合的碳化硅半导体制造厂,标志着在芯片生产方面自力更生迈出了一大步。 On November 1, 2025, India began construction on its first integrated silicon carbide semiconductor manufacturing plant in Bhubaneswar, Odisha, marking a major step toward self-reliance in chip production. 该项目由SiCSem Pvt牵头。 The project, led by SiCSem Pvt. 公司的目标是到2027年到2028年生产6万个SiC晶片,并包装9600万个单位. Ltd. with a ₹2,067 crore investment, aims to produce 60,000 SiC wafers annually and package 96 million units by 2027–2028. 它支持电动车辆、可再生能源和数据中心等关键部门,预计将创造大约5 000个工作岗位。 It supports critical sectors like electric vehicles, renewable energy, and data centers, and is expected to create around 5,000 jobs. 该设施是减少对进口芯片的依赖和加强印度半导体生态系统的国家努力的一部分,得到政府举措的支持,包括设在伊特布巴内斯瓦的研究中心和一个专门的半导体实验室。 The facility is part of national efforts to reduce reliance on imported chips and strengthen India’s semiconductor ecosystem, backed by government initiatives including a research center at IIT Bhubaneswar and a dedicated semiconductor lab.