基底是旧金山的启动项目,正在开发X射线平面印刷芯片,以降低成本和促进美国半导体制造,挑战ASML和TSMC。 Substrate, a San Francisco startup, is developing X-ray lithography chips to cut costs and boost U.S. semiconductor manufacturing, challenging ASML and TSMC.

San Francisco启动的基底公司开发了一个芯片制造工具,使用X射线平面印刷,可以挑战ASML的EUV系统,目的是降低成本,支持美国努力重新上岸半导体生产。 Substrate, a San Francisco startup, has developed a chipmaking tool using X-ray lithography that could challenge ASML’s EUV systems, aiming to lower costs and support U.S. efforts to reshore semiconductor production. 该公司得到了包括In-Q-Tel公司和General Catalyst公司在内的投资者的1亿美元支持,计划建立一个国内合同制造企业,以对抗TSMC公司。 Backed by $100 million from investors including In-Q-Tel and General Catalyst, the company plans to build a domestic contract manufacturing business to rival TSMC. 其技术虽然仍在开发中,但有可能以目前成本的一小部分产生高分辨率芯片,如果取得成功,可能会对国家安全和经济产生潜在影响。 While still in development, its technology promises high-resolution chip fabrication at a fraction of current costs, with potential national security and economic implications if successful.