箭头和EMASS联手把超低功率的AI芯片带到边缘装置上,切断了对云的依赖。 Arrow and EMASS teamed up to bring ultra-low-power AI chips to edge devices, cutting cloud reliance.

Erown Electronics和EMASS合作,利用EMAS的ECS-DoT芯片系统推进超低功率边缘AI,使磨损器、工业传感器和智能装置能够实时进行毫瓦水平的AI处理。 Arrow Electronics and EMASS have partnered to advance ultra-low-power edge AI using EMASS’s ECS-DoT System on Chip, enabling real-time AI processing at milliwatt levels for wearables, industrial sensors, and smart devices. 合作将箭头的工程、供应链和一体化专门知识与EMASS的专门人工智能芯片结合起来,在NTU-Arrow发明实验室的支持下,通过新的软件工具、参考设计和培训加速发展。 The collaboration combines Arrow’s engineering, supply chain, and integration expertise with EMASS’s specialized AI chip to accelerate development through new software tools, reference designs, and training, supported by the NTU-Arrow Invent Lab. 联合解决方案将在2025年10月29日至31日新加坡创新和技术周(SWITCH)上展示, Joint solutions will be demonstrated at Singapore Week of Innovation and Technology (SWITCH) October 29–31, 2025, aiming to expand market access and reduce dependence on cloud computing.