Lam研究为AI和高性能装置推出新的增进技术,提高先进芯片包装的精确度和效率。 Lam Research launches new etch tech boosting precision and efficiency in advanced chip packaging for AI and high-performance devices.

Lam研究揭示了先进包装牵引技术的突破,提高了生产用于AI、高性能计算和移动设备的下一代半导体的精度和效率。 Lam Research has unveiled a breakthrough in advanced packaging etch technology, enhancing precision and efficiency in manufacturing next-gen semiconductors for AI, high-performance computing, and mobile devices. 创新通过提高产量、减少缺陷和降低成本,支持了2.5D和3D芯片包装。 The innovation supports 2.5D and 3D chip packaging by improving yield, reducing defects, and lowering costs. 该技术已经在生产系统中部署,并准备帮助今后的芯片节点过渡。 The technology is already being deployed in production systems and is poised to aid future chip node transitions. 全球对先进芯片的需求上升, 半导体供应链投资增加, 特别是在美国和亚洲。 The development highlights Lam’s leadership amid rising global demand for advanced chips and increased investment in semiconductor supply chains, particularly in the U.S. and Asia.