瑞士公司Enclustra发射有50个TOPS芯片的AI模块,用于制造业、机器人和国防的边缘计算。 Swiss firm Enclustra launches AI module with 50 TOPS chip for edge computing in manufacturing, robotics, and defense.

瑞士FPGA领导人Enclutra与Sima.ai合作发起了MLSoCTM Modalix系统在Module上与Sima.ai的MLSoCTM Modalix系统,在边缘安装了50个高性能、节能AI的TOPS芯片,用于高性能、节能AI。 Enclustra, a Swiss FPGA leader, has launched the MLSoC™ Modalix System-on-Module with SiMa.ai, featuring a 50 TOPS chip for high-performance, energy-efficient AI at the edge. 该模块以针对制造、机器人和防御为目标,支持多模式和基因型AI,提供广泛的I/O、无缝整合和工业级热管理。 Targeting manufacturing, robotics, and defense, the module supports multi-modal and generative AI with extensive I/O, seamless integration, and industrial-grade thermal management. 开发通过使用Python,PyTorch和OpenCV的SiMa.ai的ONE平台进行简化. Development is streamlined via SiMa.ai’s ONE Platform using Python, PyTorch, and OpenCV. 早期存取样本可供使用,有提前交货的订单,标志着边缘人工智能部署的重要进展。 Early access samples are available, with orders open for early delivery, marking a key advance in edge AI deployment.