3M加入全球芯片组,开发更大的人工智能和汽车芯片干涉器。 3M joins global chip group to develop larger interposers for AI and auto chips.

3M公司加入了JOINT3,这是一个由日本Resonac公司牵头的全球半导体财团,以推进下一代小组级有机干涉器。 3M has joined JOINT3, a global semiconductor consortium led by Japan’s Resonac, to advance next-generation panel-level organic interposers. 该小组正在开发规模更大的515 x 510毫米平方块板,以提高制造效率和产量,取代传统的圆形丝。 The group is developing larger 515 x 510mm square panels to boost manufacturing efficiency and yield, replacing traditional circular wafers. 这一转变支持了AI和自主车辆对高性能芯片日益增长的需求,尤其是通过通过干涉器连接多种芯片的2.xD包装。 This shift supports growing demand for high-performance chips in AI and autonomous vehicles, particularly through 2.xD packaging that links multiple chips via interposers. 3M公司正在贡献其材料科学专长,以克服先进包装中的规模化挑战。 3M is contributing its materials science expertise to overcome scaling challenges in advanced packaging.